Korea Aerospace Industries (KAI) is formally establishing a collaborative framework with key government agencies and industry partners to develop on-device AI semiconductors for defense applications.
The initiative involves the Ministry of Trade, Industry and Energy (MOTIE), Korea Institute for Advancement of Technology (KIAT), Korea Semiconductor Industry Association, and Korea Fabless Industry Association.
On May 20, at the AI Semiconductor Collaboration Forum held at the Westin Chosun Hotel in Seoul, major demand-side companies—including MOTIE, KIAT, Hyundai Motor, LG Electronics, Doosan Robotics, Daedong, and KAI—signed a Memorandum of Understanding (MOU) for jointly developing K-On-Device AI Semiconductor Technologies.
On-device AI semiconductors are designed to perform real-time AI computations independently within devices, without relying on cloud connectivity. These chips boast high processing speeds, enhanced security, and low power consumption. Such features are particularly critical in defense applications, where security and stability are paramount.
Building on this collaboration, KAI plans to incorporate AI semiconductor technology into its defense technologies, with a focus on developing autonomous control systems (ACS) for embedded AI pilot technology. This will be further expanded into unmanned and manned aerial platforms (AAP), communication satellites, and other defense systems.
Through this strategy, KAI aims to embed AI capabilities into existing aircraft such as the T-50 and FA-50, enhancing their unmanned/manned hybrid operation capabilities and reinforcing its competitiveness in next-generation aerospace power. Additionally, the integration of AI technologies is expected to create new opportunities for KAI in the global export market, solidifying its technological edge.
KAI plans to utilize the AI semiconductor technology secured through this partnership to advance unmanned system technologies, accelerate the development of next-generation combat systems, and expand its global business footprint.
